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Porous Ultra Low-k Material Integration Through An Extended Dual Damascene Approach: Pre-/ Post-CMP Curing Comparison

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Bibliographic Details
Authors and Corporations: Calvo, Jesús, Koch, Johannes, Thrun, Xaver, Seidel, Robert, Uhlig, Benjamin
Title: Porous Ultra Low-k Material Integration Through An Extended Dual Damascene Approach: Pre-/ Post-CMP Curing Comparison
Type of Resource: E-Book
Language: English
published:
Chemnitz Technische Universität Chemnitz
Online-Ausg.. 2016
Series: Porous Ultra Low-k Material Integration Through An Extended Dual Damascene Approach: Pre-/ Post-CMP Curing Comparison; AMC 2015 – Advanced Metallization Conference
Subjects:
Cmp
Source: Qucosa