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online resource

Low-k SiCxNy Etch-Stop/Diffusion Barrier Films for Back-End Interconnect Applications

Bibliographic Details
Authors and Corporations: Leu, Jihperng, Tu, H.E., Chang, W.Y., Chang, C.Y., Chen, Y.C., Chen, W.C., Zhou, H.Y.
Title: Low-k SiCxNy Etch-Stop/Diffusion Barrier Films for Back-End Interconnect Applications
Type of Resource: E-Book
Language: English
published:
Chemnitz Technische Universität Chemnitz
Online-Ausg.. 2016
Series: Low-k SiCxNy Etch-Stop/Diffusion Barrier Films for Back-End Interconnect Applications; AMC 2015 – Advanced Metallization Conference
Subjects:
Source: Qucosa